Reliability Evaluation Through Analytics and Data for Emerging Technology in Photovoltaics

CSEM Module Lamination + Reliability Testing

Indoor Stability Lab

  • Interconnection (several approaches validated)
  • Lamination (glass/glass, glass/backsheet, frontsheet/backsheet, all validated)
  • IEC 61215 reliability testing (damp heat, thermal cycling, humidity freeze, UV, hot spot, potential induced degradation, etc.)
  • ISOS L testing

CSEM Module Lamination + Reliability Testing offers external users under Ready-PV a full pipeline for encapsulating, stress-testing, and characterizing emerging PV devices.

A membrane laminator encapsulates single-junction or tandem cells (2, 3, or 4-terminal), cell strings, single-cell laminates, or full modules—with lamination materials and process parameters already validated for perovskite single-junction and perovskite/silicon tandem devices.

Reliability testing covers the full range of IEC 61215 stress conditions: damp-heat, thermal cycling, humidity-freeze, UV exposure, hot-spot and PID testing, creep and mechanical stress, bypass-diode evaluation, and fire testing.

Characterization tools available before and after stress testing include dark/illuminated I-V, spectral response (EQE), photoluminescence and electroluminescence imaging/spectroscopy, Suns-Voc, dark lock-in thermography, X-ray diffraction, UV-Vis-NIR spectroscopy, confocal microscopy, and SEM.

Together, this suite lets users encapsulate their own devices, quantify cell-to-module losses, and pinpoint failure modes under real-world environmental stressors.